Product Summary

Thermal silica is the air gap between the filling heating devices and heat sink or metal base, they are flexible and elastic characteristics so that it can be used to cover a very uneven surface. Heat conduction from the separation device or the entire PCB to the metal housing or the diffusion plate, which can improve the efficiency and service life of the heat generating electronic components.

Features

? Extreme compliancy allows material to “totally blanket” component(s)
? Thermal conductivity of 1.2 W/mK
? Available in thicknesses from 0.020” - 0.200” (.5mm – 5.0mm)
? Low compression set enables the pad to be reused many times